Speed cool solidification
Its thermal resistance up to 80°C allows allows for the intergration of potentially warm electronics such as motherboards
GB/T 9341) 2150 ± 64 Bending strength (MPa) ASTM D790 (ISO 178
makes it an ideal material for batteries
meaning that the vertical burning of the filament
PA12 Translucent [Omni 1.75mm] 1Kg Model = Figure-4 Speed cool solidificationPA 12 combines mechanical strength, flexibility and chemical resistance (oils, greases, gasoline) and superior thermal, great impact resistance, flexibility and great dimensional stability. Finish of this filament is quite smooth which gives it low friction properties (large sliding). APPLICATIONS: automotive, electronics industry, metal replacement applications, such as bearings, gears, pulleys, sprockets and in industrial machinery for damping.